Posted opportunity — confirm at source
CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
National Institute of Standards and Technology · 2023-NIST-CHIPS-SMME-01
See source for award amount
2026-11-01-00-00-00
Confirm exact timezone in the announcement.Others (see text field entitled "Additional Information on Eligibility" for clarification)
Geographic eligibility and all attachment-specific conditions require review of the original announcement.
Eligibility details
An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
Matching funds & resources
Source matching-funds field: Not Required.
Matching funds and leveraged resources are different requirements. Read the description and reviewed rules below before determining resource commitments.
About this opportunity
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov . If you have any questions on how to apply, please email apply@chips.gov.
Funding geography: Not specified — review source. A funder’s address does not establish eligibility.
Review original source ↗Funding instrument: Cooperative Agreement. Issuing jurisdiction: Federal. This is not a geographic eligibility determination.
Source fields and evidence
id: 350338
Source ↗ · id
opportunityNumber: 2023-NIST-CHIPS-SMME-01
Source ↗ · opportunityNumber
opportunityTitle: CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment
Source ↗ · opportunityTitle
revision: 2
Source ↗ · revision
agencyDetails: {"code":"NIST","seed":"DOC-NIST","agencyName":"National Institute of Standards and Technology","agencyCode":"DOC-NIST","topAgencyCode":"DOC"}
Source ↗ · agencyDetails
owningAgencyCode: DOC-NIST
Source ↗ · owningAgencyCode
cfdas: [{"id":414430,"opportunityId":350338,"cfdaNumber":"11.037","programTitle":"CHIPS Incentives Program"}]
Source ↗ · cfdas
applicantTypes: [{"id":"25","description":"Others (see text field entitled \"Additional Information on Eligibility\" for clarification)"}]
Source ↗ · applicantTypes
applicantEligibilityDesc: An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.
Source ↗ · applicantEligibilityDesc
fundingInstruments: [{"id":"CA","description":"Cooperative Agreement"}]
Source ↗ · fundingInstruments
fundingActivityCategories: [{"id":"ST","description":"Science and Technology and other Research and Development"}]
Source ↗ · fundingActivityCategories
awardFloor: none
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awardCeiling: none
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responseDate: Nov 01, 2026 12:00:00 AM EDT
Source ↗ · responseDate
responseDateStr: 2026-11-01-00-00-00
Source ↗ · responseDateStr
costSharing: false
Source ↗ · costSharing
lastUpdatedDate: Oct 16, 2025 06:17:20 PM EDT
Source ↗ · lastUpdatedDate
status: posted
Source ↗ · oppHits[id=350338].oppStatus
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